 | | | | | 厂家: - 采样率(每秒): 125k 零件状态: Obsolete 工作温度: -40°C ~ 125°C 封装/外壳: 8-SOIC (0.154", 3.90mm Width) |
 | | | | | 厂家: - 采样率(每秒): 125k 零件状态: Obsolete 工作温度: -40°C ~ 125°C 封装/外壳: 8-SOIC (0.154", 3.90mm Width) |
 | | | | | 厂家: - 采样率(每秒): 125M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 64-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 80M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 64-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 125M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 65M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 4M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 48-TQFP |
 | | | | | 厂家: - 采样率(每秒): 125M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 10M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 32-LQFP |
 | | | | | 厂家: - 采样率(每秒): 50M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 80M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 250k 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 48-TQFP |
 | | | | | 厂家: - 采样率(每秒): 25M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 56-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 500k 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 48-TQFP |
 | | | | | 厂家: - 采样率(每秒): 80M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 80M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 80M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 1M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: SOT-23-8 |
 | | | | | 厂家: - 采样率(每秒): 50M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 56-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 50M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 56-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 125M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 125M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 125M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 2M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 28-TSSOP (0.173", 4.40mm Width) |
 | | | | | 厂家: - 采样率(每秒): 50M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 50M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 50M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 25M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 56-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 600k 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 28-VQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 20k 零件状态: Obsolete 工作温度: -55°C ~ 115°C (TA) 封装/外壳: 20-SSOP (0.154", 3.90mm Width) |
 | | | | | 厂家: - 采样率(每秒): 4M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 125M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 56-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 125M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 56-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 160M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 160M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 80M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 64-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 200k 零件状态: Discontinued at Digi-Key 工作温度: -55°C ~ 125°C 封装/外壳: 20-SOIC (0.295", 7.50mm Width) |
 | | | | | 厂家: - 采样率(每秒): 80M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 56-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 125M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 56-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 125M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 56-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 200M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 64-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 80M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 56-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 80M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 56-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 125M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 50M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 56-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 50M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 56-VFQFN Exposed Pad |
 | | | | | 厂家: - 采样率(每秒): 40M 零件状态: Obsolete 工作温度: 0°C ~ 70°C 封装/外壳: 257-LFBGA |
 | | | | | 厂家: - 采样率(每秒): 500k 零件状态: Discontinued at Digi-Key 工作温度: 0°C ~ 70°C 封装/外壳: SOT-23-8 Thin, TSOT-23-8 |
 | | | | | 厂家: - 采样率(每秒): 50 零件状态: Active 工作温度: 0°C ~ 70°C 封装/外壳: 16-SOIC (0.295", 7.50mm Width) |
 | | | | | 厂家: - 采样率(每秒): 160M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |