| | | | | 厂家: - 采样率(每秒): 20M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 48-TQFP |
| | | | | 厂家: - 采样率(每秒): 20M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 48-TQFP |
| | | | | 厂家: - 采样率(每秒): 20M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 48-TQFP |
| | | | | 厂家: - 采样率(每秒): 300k 零件状态: Obsolete 工作温度: -40°C ~ 125°C 封装/外壳: 8-SOIC (0.154", 3.90mm Width) |
| | | | | 厂家: - 采样率(每秒): 300k 零件状态: Obsolete 工作温度: -40°C ~ 125°C 封装/外壳: 8-SOIC (0.154", 3.90mm Width) |
| | | | | 厂家: - 采样率(每秒): 300k 零件状态: Obsolete 工作温度: -40°C ~ 125°C 封装/外壳: 8-SOIC (0.154", 3.90mm Width) |
| | | | | 厂家: - 采样率(每秒): 300k 零件状态: Obsolete 工作温度: -40°C ~ 125°C 封装/外壳: 8-SOIC (0.154", 3.90mm Width) |
| | | | | 厂家: - 采样率(每秒): 125k 零件状态: Obsolete 工作温度: -40°C ~ 125°C 封装/外壳: 8-SOIC (0.154", 3.90mm Width) |
| | | | | 厂家: - 采样率(每秒): 125k 零件状态: Obsolete 工作温度: -40°C ~ 125°C 封装/外壳: 8-SOIC (0.154", 3.90mm Width) |
| | | | | 厂家: - 采样率(每秒): 125k 零件状态: Obsolete 工作温度: -40°C ~ 125°C 封装/外壳: 8-SOIC (0.154", 3.90mm Width) |
| | | | | 厂家: - 采样率(每秒): 125k 零件状态: Obsolete 工作温度: -40°C ~ 125°C 封装/外壳: 8-SOIC (0.154", 3.90mm Width) |
| | | | | 厂家: - 采样率(每秒): 125k 零件状态: Obsolete 工作温度: -40°C ~ 125°C 封装/外壳: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
| | | | | 厂家: - 采样率(每秒): 125k 零件状态: Obsolete 工作温度: -40°C ~ 125°C 封装/外壳: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
| | | | | 厂家: - 采样率(每秒): 187.5k 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
| | | | | 厂家: - 采样率(每秒): 187.5k 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
| | | | | 厂家: - 采样率(每秒): 40M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 48-LQFP |
| | | | | 厂家: - 采样率(每秒): 40M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 48-LQFP |
| | | | | 厂家: - 采样率(每秒): 40M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 48-LQFP |
| | | | | 厂家: - 采样率(每秒): 20M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 48-LQFP |
| | | | | 厂家: - 采样率(每秒): 40M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 48-LQFP |
| | | | | 厂家: - 采样率(每秒): 40M 零件状态: Obsolete 工作温度: 0°C ~ 85°C 封装/外壳: 48-LQFP |
| | | | | 厂家: - 采样率(每秒): 250M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 64-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 66k 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 20-SSOP (0.209", 5.30mm Width) |
| | | | | 厂家: - 采样率(每秒): 66k 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 20-SSOP (0.209", 5.30mm Width) |
| | | | | 厂家: - 采样率(每秒): 1M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 16-VQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 38k 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 20-SSOP (0.209", 5.30mm Width) |
| | | | | 厂家: - 采样率(每秒): 38k 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 20-SSOP (0.209", 5.30mm Width) |
| | | | | 厂家: - 采样率(每秒): 250k 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
| | | | | 厂家: - 采样率(每秒): 2M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 125°C 封装/外壳: 16-WFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 1M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 125°C 封装/外壳: 24-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 1M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 125°C 封装/外壳: 24-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 100M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 64-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 4M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 500k 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 125°C 封装/外壳: 16-TSSOP (0.173", 4.40mm Width) |
| | | | | 厂家: - 采样率(每秒): 400k 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 10-VFDFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 400k 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 10-VFDFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 1M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 210M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 64-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 80M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 64-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 125M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 56-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 125M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 64-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 200k 零件状态: Discontinued at Digi-Key 工作温度: -55°C ~ 125°C 封装/外壳: 20-SOIC (0.295", 7.50mm Width) |
| | | | | 厂家: - 采样率(每秒): 125M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 56-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 200M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 64-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 105M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 80M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 56-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 50M 零件状态: Obsolete 工作温度: -40°C ~ 85°C 封装/外壳: 56-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 125k 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 8-VDFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 210M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 48-VFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 80M 零件状态: Discontinued at Digi-Key 工作温度: -40°C ~ 85°C 封装/外壳: 64-VFQFN Exposed Pad |