| | IC MMIC I/Q UPCONVERTER 32SMD 射频IC模块 | | | 厂家: - 系列: - RF 类型: Radar 安装类型: Surface Mount 封装/外壳: 32-TFCQFN Exposed Pad 供应商器件封装: 32-CSMT (5x5) |
| | IC FREQ DIVIDER 10-26GHZ 16-QFN 射频IC模块 | | | 厂家: - 系列: - RF 类型: VSAT, DBS 安装类型: Surface Mount 封装/外壳: 16-VFQFN Exposed Pad 供应商器件封装: 16-SMT (3x3) |
| | IC MULTIPLIER X2 24-QFN 射频IC模块 | | | 厂家: - 系列: - RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 24-VFQFN Exposed Pad 供应商器件封装: 24-SMT (4x4) |
| | IC MMIC AMP VCO HBT 2OUT 32-QFN 射频IC模块 | | | 厂家: - 系列: - RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 32-VFQFN Exposed Pad 供应商器件封装: 32-QFN (5x5) |
| | IC FREQ DIVIDER DC-7GHZ 8MSOP 射频IC模块 | | | 厂家: - 系列: - RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad 供应商器件封装: 8-MSG |
| | IC MULTIPLIER X4 ACTIVE 24SMD 射频IC模块 | | | 厂家: - 系列: - RF 类型: Radar 安装类型: Surface Mount 封装/外壳: 24-VFQFN Exposed Pad 供应商器件封装: 24-SMT (4x4) |
| | RF HBT PROG 5BIT COUNTER 24QFN 射频IC模块 | | | 厂家: - 系列: - RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 24-VFQFN Exposed Pad 供应商器件封装: 24-QFN (4x4) |
| | IC AMP VGA 300MHZ DUAL 32LFCSP 射频IC模块 | | | 厂家: - 系列: - RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 32-WFQFN Exposed Pad, CSP 供应商器件封装: 32-LFCSP-WQ (5x5) |
| | IC QUADRATURE MODULATOR 32LFCSP 射频IC模块 | | | 厂家: - 系列: - RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 32-VFQFN Exposed Pad, CSP 供应商器件封装: 32-LFCSP-VQ (5x5) |
| | IC DIVIDER DC-12GHZ BY-4 8SMD 射频IC模块 | | | 厂家: - 系列: - RF 类型: VSAT 安装类型: Surface Mount 封装/外壳: 8-SOIC (0.154", 3.90mm Width) Exposed Pad 供应商器件封装: 8-SMT |
| | IC MULTIPLIER 2.0GHZ 16LFCSP 射频IC模块 | | | 厂家: - 系列: - RF 类型: - 安装类型: Surface Mount 封装/外壳: 16-VFQFN Exposed Pad, CSP 供应商器件封装: 16-LFCSP-VQ (3x3) |
| | IC FREQ DIVIDER DC-8GHZ SOT26 射频IC模块 | | | 厂家: - 系列: - RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: SOT-23-6 供应商器件封装: SOT-26 |
| | IC DOWNCONV HI-IP3 2CH 28QFN 射频IC模块 | | | 厂家: - 系列: - RF 类型: Cellular, CDMA 安装类型: Surface Mount 封装/外壳: 28-VQFN Exposed Pad 供应商器件封装: 28-QFN (6x6) |
| | IC IF DIGIT SUBSYSTEM 48-LQFP 射频IC模块 | | | 厂家: - 系列: - RF 类型: UHF, Cellular, TETRA, GSM, EDGE, APCO25 安装类型: Surface Mount 封装/外壳: 48-LQFP 供应商器件封装: 48-LQFP (7x7) |
| | IC DIVIDER X8 PRESCALER 16-QFN 射频IC模块 | | | 厂家: - 系列: - RF 类型: VSAT 安装类型: Surface Mount 封装/外壳: 16-VQFN Exposed Pad 供应商器件封装: - |
| | IC FREQ DIVIDER DC-10GHZ 射频IC模块 | | | 厂家: - 系列: - RF 类型: VSAT, DBS 安装类型: Surface Mount 封装/外壳: 8-SOIC (0.173", 4.40mm Width) 供应商器件封装: 8-SMT |
| | IC FREQ DIVIDER DC-13GHZ 射频IC模块 | | | 厂家: - 系列: - RF 类型: VSAT, DBS 安装类型: Surface Mount 封装/外壳: 8-SOIC (0.173", 4.40mm Width) 供应商器件封装: 8-SMT |
| | IC OSC VCO W/BUFFER AMP 24SMD 射频IC模块 | | | 厂家: - 系列: - RF 类型: Radar 安装类型: Surface Mount 封装/外壳: 24-TFCQFN Exposed Pad 供应商器件封装: 24-CSMT (4x4) |
| | IC OSC VCO W/BUFFER AMP 24SMD 射频IC模块 | | | 厂家: - 系列: - RF 类型: Radar 安装类型: Surface Mount 封装/外壳: 24-TFCQFN Exposed Pad 供应商器件封装: 24-CSMT (4x4) |
| | IC FREQ DOUBLER 9-16GHZ 24QFN 射频IC模块 | | | 厂家: - 系列: - RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 24-VFQFN Exposed Pad 供应商器件封装: 24-QFN (4x4) |
| | IC DIVIDER DC-12GHZ BY-4 8SMD 射频IC模块 | | | 厂家: - 系列: - RF 类型: VSAT 安装类型: Surface Mount 封装/外壳: 8-SOIC (0.154", 3.90mm Width) Exposed Pad 供应商器件封装: 8-SMT |
| | IC MMIC VCO BUFFER AMP 24-QFN 射频IC模块 | | | 厂家: - 系列: - RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 24-VFQFN Exposed Pad 供应商器件封装: 24-QFN (4x4) |
| | IC MMIC VCO BUFFER AMP 24-QFN 射频IC模块 | | | 厂家: - 系列: - RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 24-VFQFN Exposed Pad 供应商器件封装: 24-QFN (4x4) |
| | IC FREQ DIVIDER DC-10GHZ 8SOIC 射频IC模块 | | | 厂家: - 系列: - RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 8-SOIC (0.154", 3.90mm Width) Exposed Pad 供应商器件封装: 8-SMT |
| | IC MULTIPLIER X2 ACTIVE 12SMD 射频IC模块 | | | 厂家: - 系列: - RF 类型: VSAT, DBS 安装类型: Surface Mount 封装/外壳: 12-VFQFN Exposed Pad 供应商器件封装: 12-SMT (3x3) |
| | IC X4 ACTIVE MULTIPLIER 24-QFN 射频IC模块 | | | 厂家: - 系列: - RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 24-VFQFN Exposed Pad 供应商器件封装: 24-SMT (4x4) |
| | IC FREQ DIVIDER DC-12GHZ 8SMD 射频IC模块 | | | 厂家: - 系列: - RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 8-SOIC (0.154", 3.90mm Width) Exposed Pad 供应商器件封装: 8-SMT |
| | IC CROSSPOINT SW EQALIZER 168BGA 射频IC模块 | | | 厂家: - 系列: - RF 类型: - 安装类型: Surface Mount 封装/外壳: 169-LBGA 供应商器件封装: 169-BGA (13x13) |
| | IC MULTIPLIER X2 BB 12SMD 射频IC模块 | | | 厂家: - 系列: - RF 类型: VSAT, DBS 安装类型: Surface Mount 封装/外壳: 12-VFQFN Exposed Pad 供应商器件封装: 12-SMT (3x3) |
| | IC MMIC I/Q UPCONVERTER 32SMD 射频IC模块 | | | 厂家: - 系列: - RF 类型: Radar 安装类型: Surface Mount 封装/外壳: 32-TFCQFN Exposed Pad 供应商器件封装: 32-CSMT (5x5) |
| | IC CONV RECEIVER HIGH IP3 28QFN 射频IC模块 | | | 厂家: - 系列: - RF 类型: Cellular, CDMA 安装类型: Surface Mount 封装/外壳: 28-VQFN Exposed Pad 供应商器件封装: 28-QFN (6x6) |
| | IC OSC VCO W/BUFFER AMP 24SMD 射频IC模块 | | | 厂家: - 系列: - RF 类型: Radar 安装类型: Surface Mount 封装/外壳: 24-TFQFN Exposed Pad 供应商器件封装: 24-SMT (4x4) |
| | CTSD BPO ADC 100 MHZ BW 射频IC模块 | | | 厂家: - 系列: - RF 类型: - 安装类型: Surface Mount 封装/外壳: 80-WFBGA, WLCSP 供应商器件封装: 80-WLSCP (4.29x5.04) |
| | IC FLIP-FLOP D-TYPE 13GBPS 16SMD 射频IC模块 | | | 厂家: - 系列: - RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 16-LFCQFN Exposed Pad 供应商器件封装: 16-CSMT (3x3) |
| | | | | 厂家: - 系列: - RF 类型: Radar 安装类型: Surface Mount 封装/外壳: 16-CSMD Module 供应商器件封装: 16-CSMT (5x5) |