| | | | | 厂家: - 采样率(每秒): 170M 零件状态: Active 工作温度: 0°C ~ 70°C 封装/外壳: 64-WFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 1.25M 零件状态: Active 工作温度: 0°C ~ 70°C 封装/外壳: 48-TFSOP (0.240", 6.10mm Width) |
| | | | | 厂家: - 采样率(每秒): 400k 零件状态: Active 工作温度: 0°C ~ 70°C 封装/外壳: 48-TFSOP (0.240", 6.10mm Width) |
| | | | | 厂家: - 采样率(每秒): 2.5M 零件状态: Active 工作温度: 0°C ~ 70°C 封装/外壳: 48-LQFP |
| | | | | 厂家: - 采样率(每秒): 130M 零件状态: Active 工作温度: -40°C ~ 85°C 封装/外壳: 64-WFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 200k 零件状态: Active 工作温度: -40°C ~ 85°C 封装/外壳: 48-LQFP |
| | | | | 厂家: - 采样率(每秒): 10M 零件状态: Active 工作温度: -40°C ~ 85°C 封装/外壳: 32-WFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 200k 零件状态: Active 工作温度: -40°C ~ 85°C (TA) 封装/外壳: 48-LQFP |
| | | | | 厂家: - 采样率(每秒): 11.1k 零件状态: Active 工作温度: -40°C ~ 85°C 封装/外壳: 8-DIP (0.300", 7.62mm) |
| | | | | 厂家: - 采样率(每秒): 100k 零件状态: Active 工作温度: -40°C ~ 85°C 封装/外壳: 28-SSOP (0.209", 5.30mm Width) |
| | | | | 厂家: - 采样率(每秒): 500k 零件状态: Active 工作温度: -40°C ~ 85°C 封装/外壳: 36-SSOP (0.209", 5.30mm Width) |
| | | | | 厂家: - 采样率(每秒): 210M 零件状态: Active 工作温度: -40°C ~ 85°C 封装/外壳: 64-WFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 65M 零件状态: Active 工作温度: -40°C ~ 85°C 封装/外壳: 40-WFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 1M 零件状态: Active 工作温度: 0°C ~ 70°C 封装/外壳: 16-WFDFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 105M 零件状态: Active 工作温度: 0°C ~ 70°C 封装/外壳: 64-WFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 40M 零件状态: Active 工作温度: 0°C ~ 70°C 封装/外壳: 64-WFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 20M 零件状态: Active 工作温度: -40°C ~ 85°C 封装/外壳: 64-WFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 40M 零件状态: Active 工作温度: -40°C ~ 85°C 封装/外壳: 64-WFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 125M 零件状态: Active 工作温度: -40°C ~ 85°C 封装/外壳: 64-WFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 7.5 零件状态: Active 工作温度: 0°C ~ 70°C 封装/外壳: 28-SSOP (0.209", 5.30mm Width) |
| | | | | 厂家: - 采样率(每秒): 185M 零件状态: Active 工作温度: -40°C ~ 85°C 封装/外壳: 64-WFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 50M 零件状态: Active 工作温度: 0°C ~ 70°C 封装/外壳: 48-TFSOP (0.240", 6.10mm Width) |
| | | | | 厂家: - 采样率(每秒): 1.25M 零件状态: Active 工作温度: 0°C ~ 70°C 封装/外壳: 48-TFSOP (0.240", 6.10mm Width) |
| | | | | 厂家: - 采样率(每秒): 250k 零件状态: Active 工作温度: -40°C ~ 85°C 封装/外壳: 28-SSOP (0.209", 5.30mm Width) |
| | | | | 厂家: - 采样率(每秒): 1M 零件状态: Active 工作温度: 0°C ~ 70°C 封装/外壳: 16-WFDFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 200k 零件状态: Active 工作温度: -40°C ~ 85°C 封装/外壳: 48-LQFP |
| | | | | 厂家: - 采样率(每秒): 135M 零件状态: Active 工作温度: -40°C ~ 85°C 封装/外壳: 64-WFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 105M 零件状态: Active 工作温度: -40°C ~ 85°C 封装/外壳: 64-WFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 7.5 零件状态: Active 工作温度: -40°C ~ 85°C 封装/外壳: 28-SSOP (0.209", 5.30mm Width) |
| | | | | 厂家: - 采样率(每秒): 25M 零件状态: Active 工作温度: -40°C ~ 85°C 封装/外壳: 64-WFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 7.5 零件状态: Active 工作温度: -40°C ~ 85°C 封装/外壳: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
| | | | | 厂家: - 采样率(每秒): 7.5 零件状态: Active 工作温度: -40°C ~ 85°C 封装/外壳: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
| | | | | 厂家: - 采样率(每秒): 600k 零件状态: Active 工作温度: 0°C ~ 70°C 封装/外壳: 32-WFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 65M 零件状态: Active 工作温度: 0°C ~ 70°C 封装/外壳: 32-WFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 65M 零件状态: Active 工作温度: 0°C ~ 70°C 封装/外壳: 32-WFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 1M 零件状态: Active 工作温度: -40°C ~ 125°C 封装/外壳: 32-WFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 200k 零件状态: Active 工作温度: -40°C ~ 125°C 封装/外壳: 48-LQFP |
| | | | | 厂家: - 采样率(每秒): 5M 零件状态: Active 工作温度: -40°C ~ 85°C 封装/外壳: 32-WFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 7.5 零件状态: Active 工作温度: -40°C ~ 85°C 封装/外壳: 28-SSOP (0.209", 5.30mm Width) |
| | | | | 厂家: - 采样率(每秒): 25M 零件状态: Active 工作温度: -40°C ~ 85°C 封装/外壳: 40-WFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 25M 零件状态: Active 工作温度: 0°C ~ 70°C 封装/外壳: 64-WFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 10M 零件状态: Active 工作温度: 0°C ~ 70°C 封装/外壳: 64-WFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 1.6M 零件状态: Active 工作温度: -40°C ~ 85°C 封装/外壳: 16-WFDFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 333k 零件状态: Active 工作温度: 0°C ~ 70°C 封装/外壳: 36-SSOP (0.209", 5.30mm Width) |
| | | | | 厂家: - 采样率(每秒): 7.5 零件状态: Active 工作温度: 0°C ~ 70°C 封装/外壳: 28-SSOP (0.209", 5.30mm Width) |
| | | | | 厂家: - 采样率(每秒): 65M 零件状态: Active 工作温度: 0°C ~ 70°C 封装/外壳: 40-WFQFN Exposed Pad |
| | | | | 厂家: - 采样率(每秒): 500k 零件状态: Active 工作温度: 0°C ~ 70°C 封装/外壳: 36-SSOP (0.209", 5.30mm Width) |
| | | | | 厂家: - 采样率(每秒): 100k 零件状态: Active 工作温度: 0°C ~ 70°C 封装/外壳: 28-SSOP (0.209", 5.30mm Width) |
| | | | | 厂家: - 采样率(每秒): 25M 零件状态: Active 工作温度: -40°C ~ 85°C 封装/外壳: 48-TFSOP (0.240", 6.10mm Width) |
| | | | | 厂家: - 采样率(每秒): 200k 零件状态: Active 工作温度: -40°C ~ 85°C 封装/外壳: 28-SSOP (0.209", 5.30mm Width) |