 | | IC VCO IF W/DIFF OUT SOT23-6 射频IC模块 | | | 厂家: - 系列: - RF 类型: Cellular, GPS, ISM 安装类型: Surface Mount 封装/外壳: SOT-23-6 供应商器件封装: SOT-23-6 |
 | | IC VCO IF W/DIFF OUT SOT23-6 射频IC模块 | | | 厂家: - 系列: - RF 类型: Cellular, GPS, ISM 安装类型: Surface Mount 封装/外壳: SOT-23-6 供应商器件封装: SOT-23-6 |
 | | IC MULT HI GAIN VECTOR 32-TQFN 射频IC模块 | | | 厂家: - 系列: - RF 类型: Cellular, DCS, GSM, PCS, UMTS 安装类型: Surface Mount 封装/外壳: 32-WFQFN Exposed Pad 供应商器件封装: 32-TQFN-EP (5x5) |
 | | IC VECTOR MULTIPLIERS 32TQFN 射频IC模块 | | | 厂家: - 系列: - RF 类型: Cellular, DCS, GSM, PCS, UMTS 安装类型: Surface Mount 封装/外壳: 32-WFQFN Exposed Pad 供应商器件封装: 32-TQFN-EP (5x5) |
 | | IC MULT HI GAIN VECTOR 32-TQFN 射频IC模块 | | | 厂家: - 系列: - RF 类型: Cellular, DCS, GSM, PCS, UMTS 安装类型: Surface Mount 封装/外壳: 32-WFQFN Exposed Pad 供应商器件封装: 32-TQFN-EP (5x5) |
 | | IC VECTOR MULTIPLIERS 32TQFN 射频IC模块 | | | 厂家: - 系列: - RF 类型: Cellular, DCS, GSM, PCS, UMTS 安装类型: Surface Mount 封装/外壳: 32-WFQFN Exposed Pad 供应商器件封装: 32-TQFN-EP (5x5) |
 | | IC MULT HI GAIN VECTOR 32-TQFN 射频IC模块 | | | 厂家: - 系列: - RF 类型: Cellular, DCS, GSM, PCS, UMTS 安装类型: Surface Mount 封装/外壳: 32-WFQFN Exposed Pad 供应商器件封装: 32-TQFN-EP (5x5) |
 | | IC VECTOR MULTIPLIERS 32TQFN 射频IC模块 | | | 厂家: - 系列: - RF 类型: Cellular, DCS, GSM, PCS, UMTS 安装类型: Surface Mount 封装/外壳: 32-WFQFN Exposed Pad 供应商器件封装: 32-TQFN-EP (5x5) |
 | | IC MODULATOR/DEMODULATOR 36-QFN 射频IC模块 | | | 厂家: - 系列: - RF 类型: CDMA, EDGE, GSM, TDMA 安装类型: Surface Mount 封装/外壳: 36-WFQFN Exposed Pad 供应商器件封装: 36-TQFN (6x6) |
 | | IC MODULATOR/DEMODULATOR QFN 射频IC模块 | | | 厂家: - 系列: - RF 类型: CDMA, EDGE, GSM, TDMA 安装类型: Surface Mount 封装/外壳: 36-WFQFN Exposed Pad 供应商器件封装: 36-TQFN (6x6) |
 | | IC MODULATOR/DEMODULATOR QFN 射频IC模块 | | | 厂家: - 系列: - RF 类型: CDMA2000, DCS1800, WCMDA/UMTS 安装类型: Surface Mount 封装/外壳: 36-WFQFN Exposed Pad 供应商器件封装: 36-TQFN (6x6) |
 | | IC QUADRATURE MODULATOR 36QFN 射频IC模块 | | | 厂家: - 系列: - RF 类型: CDMA2000, DCS1800, WCMDA/UMTS 安装类型: Surface Mount 封装/外壳: 36-WFQFN Exposed Pad 供应商器件封装: 36-TQFN (6x6) |
 | | IC QUADRATURE MODULATOR 36QFN 射频IC模块 | | | 厂家: - 系列: - RF 类型: CDMA2000, DCS1800, WCMDA/UMTS 安装类型: Surface Mount 封装/外壳: 36-WFQFN Exposed Pad 供应商器件封装: 36-TQFN (6x6) |
 | | IC SATELLITE TUNER 28TQFN 射频IC模块 | | | 厂家: - 系列: - RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: - 供应商器件封装: - |
 | | IC TUNER LOW IF CONV DGTL 40TQFN 射频IC模块 | | | 厂家: - 系列: * RF 类型: - 安装类型: Surface Mount 封装/外壳: - 供应商器件封装: - |
 | | IC TUNER BROADBAND MOBILE 40TQFN 射频IC模块 | | | 厂家: - 系列: - RF 类型: - 安装类型: Surface Mount 封装/外壳: 40-WFQFN Exposed Pad 供应商器件封装: 40-TQFN (6x6) |
 | | IC TUNER ISDB-T LOW IF 40TQFN 射频IC模块 | | | 厂家: - 系列: MAX RF 类型: UHF, VHF 安装类型: Surface Mount 封装/外壳: 40-WFQFN Exposed Pad 供应商器件封装: 40-TQFN (5x5) |
 | | IC TUNER ISDB-T LOW IF 40TQFN 射频IC模块 | | | 厂家: - 系列: - RF 类型: - 安装类型: Surface Mount 封装/外壳: 40-WFQFN Exposed Pad 供应商器件封装: 40-TQFN (6x6) |
 | | TUNER DIVERSITY SDB/DVB-T 56TQFN 射频IC模块 | | | 厂家: - 系列: - RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 56-WFQFN Exposed Pad 供应商器件封装: 56-TQFN (7x7) |
 | | IC TUNER LOW IF DGTL 40TQFN 射频IC模块 | | | 厂家: - 系列: * RF 类型: - 安装类型: Surface Mount 封装/外壳: - 供应商器件封装: - |
 | | IC TUNER BROADBAND MOBILE 40TQFN 射频IC模块 | | | 厂家: - 系列: - RF 类型: - 安装类型: Surface Mount 封装/外壳: 40-WFQFN Exposed Pad 供应商器件封装: 40-TQFN (6x6) |
 | | IC TUNER ISDB-T LOW IF 40TQFN 射频IC模块 | | | 厂家: - 系列: MAX RF 类型: UHF, VHF 安装类型: Surface Mount 封装/外壳: 40-WFQFN Exposed Pad 供应商器件封装: 40-TQFN (5x5) |
 | | IC TUNER ISDB-T LOW IF 40TQFN 射频IC模块 | | | 厂家: - 系列: - RF 类型: - 安装类型: Surface Mount 封装/外壳: 40-WFQFN Exposed Pad 供应商器件封装: 40-TQFN (6x6) |
 | | TUNER DIVERSITY SDB/DVBT 56TQFN 射频IC模块 | | | 厂家: - 系列: - RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 56-WFQFN Exposed Pad 供应商器件封装: 56-TQFN (7x7) |
 | | IC SATELLITE TUNER TQFB 射频IC模块 | | | 厂家: - 系列: - RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: - 供应商器件封装: - |
 | | IC LNA/MIXER SIGE ADJ 20TSSOP 射频IC模块 | | | 厂家: - 系列: - RF 类型: CDMA, GSM, PDC, TDMA, WCDMA 安装类型: Surface Mount 封装/外壳: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad 供应商器件封装: 20-TSSOP-EP |
 | | IC LNA/MIXER SIGE ADJ 20TSSOP 射频IC模块 | | | 厂家: - 系列: - RF 类型: CDMA, GSM, PDC, TDMA, WCDMA 安装类型: Surface Mount 封装/外壳: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad 供应商器件封装: 20-TSSOP-EP |
 | | IC LNA/MIXER SIGE ADJ 20TSSOP 射频IC模块 | | | 厂家: - 系列: - RF 类型: PCS 安装类型: Surface Mount 封装/外壳: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad 供应商器件封装: 20-TSSOP-EP |
 | | IC LNA/MIXER SIGE ADJ 20TSSOP 射频IC模块 | | | 厂家: - 系列: - RF 类型: Cellular 安装类型: Surface Mount 封装/外壳: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad 供应商器件封装: 20-TSSOP-EP |
 | | IC DOWNCONVERT W/AMP 20-QSOP 射频IC模块 | | | 厂家: - 系列: - RF 类型: DCS1800/PCS1900, DECT, PHS/PACS, PWT1900, DCT1900 安装类型: Surface Mount 封装/外壳: 20-SSOP (0.154", 3.90mm Width) 供应商器件封装: 20-QSOP |
 | | IC LNA/MIXER SIGE ADJ 20TSSOP 射频IC模块 | | | 厂家: - 系列: - RF 类型: CDMA, GSM, PDC, TDMA, WCDMA 安装类型: Surface Mount 封装/外壳: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad 供应商器件封装: 20-TSSOP-EP |
 | | IC LNA/MIXER SIGE ADJ 20TSSOP 射频IC模块 | | | 厂家: - 系列: - RF 类型: PCS 安装类型: Surface Mount 封装/外壳: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad 供应商器件封装: 20-TSSOP-EP |
 | | IC LNA/MIXER SIGE ADJ 20TSSOP 射频IC模块 | | | 厂家: - 系列: - RF 类型: CDMA, GSM, PDC, TDMA, WCDMA 安装类型: Surface Mount 封装/外壳: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad 供应商器件封装: 20-TSSOP-EP |
 | | IC LNA/MIXER SIGE ADJ 20TSSOP 射频IC模块 | | | 厂家: - 系列: - RF 类型: Cellular 安装类型: Surface Mount 封装/外壳: 20-TSSOP (0.173", 4.40mm Width) Exposed Pad 供应商器件封装: 20-TSSOP-EP |
 | | IC DOWNCONVERT W/AMP 20-QSOP 射频IC模块 | | | 厂家: - 系列: - RF 类型: DCS1800/PCS1900, DECT, PHS/PACS, PWT1900, DCT1900 安装类型: Surface Mount 封装/外壳: 20-SSOP (0.154", 3.90mm Width) 供应商器件封装: 20-QSOP |