| | IC RMS/DC CONVERTER 14DIP 特定芯片 | | | 厂家: - 包装: 管子 系列: * 安装类型: Through Hole 封装/外壳: 14-CDIP (0.300", 7.62mm) |
| | IC KIT THERMO CONTROLLER & AMP 特定芯片 | | | 厂家: - 包装: Ruidan-Reel® 系列: * 安装类型: Surface Mount 封装/外壳: 28-SSOP (0.154", 3.90mm Width) |
| | IC KIT THERMO CONTROLLER & AMP 特定芯片 | | | 厂家: - 包装: 整装 系列: * 安装类型: Surface Mount 封装/外壳: 28-SSOP (0.154", 3.90mm Width) |
| | I2C SLAVE EXTEND OVER DIFFERENTI 特定芯片 | | | 厂家: - 包装: 整装 系列: - 安装类型: Surface Mount 封装/外壳: 20-WFQFN Exposed Pad |
| | I2C SLAVE EXTEND OVER DIFFERENTI 特定芯片 | | | 厂家: - 包装: 整装 系列: - 安装类型: Surface Mount 封装/外壳: 20-WFQFN Exposed Pad |
| | IC SECONDARY SIDE CTRLR 10MSOP 特定芯片 | | | 厂家: - 包装: 整装 系列: - 安装类型: Surface Mount 封装/外壳: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad |
| | I2C SLAVE EXTEND OVER DIFFERENTI 特定芯片 | | | 厂家: - 包装: 整装 系列: - 安装类型: Surface Mount 封装/外壳: 20-WFQFN Exposed Pad |
| | IC SECONDARY SIDE CTRLR 10MSOP 特定芯片 | | | 厂家: - 包装: 整装 系列: - 安装类型: Surface Mount 封装/外壳: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad |
| | IC ELECTRONIC CIRC BREAKER 8DFN 特定芯片 | | | 厂家: - 包装: 整装 系列: - 安装类型: Surface Mount 封装/外壳: 8-WFDFN Exposed Pad |
| | IC ELECTRONIC CIRC BREAKER 8DFN 特定芯片 | | | 厂家: - 包装: 整装 系列: - 安装类型: Surface Mount 封装/外壳: 8-WFDFN Exposed Pad |
| | IC ELECTRONIC CIRC BREAKER 8DFN 特定芯片 | | | 厂家: - 包装: Ruidan-Reel® 系列: - 安装类型: Surface Mount 封装/外壳: 8-WFDFN Exposed Pad |
| | IC ELECTRONIC CIRC BREAKER 8DFN 特定芯片 | | | 厂家: - 包装: 剪切带 系列: - 安装类型: Surface Mount 封装/外壳: 8-WFDFN Exposed Pad |
| | IC ELECTRONIC CIRC BREAKER 8DFN 特定芯片 | | | 厂家: - 包装: 整装 系列: - 安装类型: Surface Mount 封装/外壳: 8-WFDFN Exposed Pad |
| | IC SECONDARY SIDE CTRLR 10MSOP 特定芯片 | | | 厂家: - 包装: 管子包装 系列: - 安装类型: Surface Mount 封装/外壳: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad |
| | IC SECONDARY SIDE CTRLR 10MSOP 特定芯片 | | | 厂家: - 包装: 管子包装 系列: - 安装类型: Surface Mount 封装/外壳: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad |
| | I2C SLAVE EXTEND OVER DIFFERENTI 特定芯片 | | | 厂家: - 包装: 管子包装 系列: - 安装类型: Surface Mount 封装/外壳: 20-WFQFN Exposed Pad |
| | I2C SLAVE EXTEND OVER DIFFERENTI 特定芯片 | | | 厂家: - 包装: 管子包装 系列: - 安装类型: Surface Mount 封装/外壳: 20-WFQFN Exposed Pad |
| | IC FLYBACK FORW CONVERTER 10MSOP 特定芯片 | | | 厂家: - 包装: 管子包装 系列: - 安装类型: Surface Mount 封装/外壳: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
| | I2C SLAVE EXTEND OVER DIFFERENTI 特定芯片 | | | 厂家: - 包装: 管子包装 系列: - 安装类型: Surface Mount 封装/外壳: 20-WFQFN Exposed Pad |
| | IC ELECTRONIC CIRC BREAKER 8DFN 特定芯片 | | | 厂家: - 包装: Ruidan-Reel® 系列: - 安装类型: Surface Mount 封装/外壳: 8-WFDFN Exposed Pad |
| | IC ELECTRONIC CIRC BREAKER 8DFN 特定芯片 | | | 厂家: - 包装: 剪切带 系列: - 安装类型: Surface Mount 封装/外壳: 8-WFDFN Exposed Pad |
| | IC ELECTRONIC CIRC BREAKER 8DFN 特定芯片 | | | 厂家: - 包装: 整装 系列: - 安装类型: Surface Mount 封装/外壳: 8-WFDFN Exposed Pad |
| | IC FLYBACK FORW CONVERTER 10MSOP 特定芯片 | | | 厂家: - 包装: Ruidan-Reel® 系列: - 安装类型: Surface Mount 封装/外壳: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
| | IC FLYBACK FORW CONVERTER 10MSOP 特定芯片 | | | 厂家: - 包装: 剪切带 系列: - 安装类型: Surface Mount 封装/外壳: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
| | IC FLYBACK FORW CONVERTER 10MSOP 特定芯片 | | | 厂家: - 包装: 整装 系列: - 安装类型: Surface Mount 封装/外壳: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |