锐单电子商城 , 一站式电子元器件采购平台!
  • 电话:400-990-0325

BGA-STD-075

ABL HEATSINKS  BGA-STD-075  散热器, 用于球栅阵列, 标准, BGA, 11 °C/W, 23 mm, 40 mm, 40 mm

The is a standard Heat Sink with thermal tape suitable for BGA packages. With excellent thermal conductivity, cushioning and gap filling properties, the pad is an ideal thermal interface material specifically designed for heat sink attachment to MPU, chip set and other plastic encapsulated components. It consists of an aluminium foil backing coated on both sides with a very high temperature resistance acrylic adhesive. Due to its high heat performance and adhesive properties this tape can also be use to attach components to a vertical heat sink and to metal enclosure surfaces.

.
Black anodised finish

BGA-STD-075 PDF数据文档
图片 型号 厂商 下载
BGA-STD-075 ABL Heatsinks
BGA-PP-035 ABL Heatsinks
BGA-STD-055 ABL Heatsinks
BGA-PP-030 ABL Heatsinks
BGA-PP-040 ABL Heatsinks
BGA-PP-015 ABL Heatsinks
BGA-FC-010 ABL Heatsinks
BGA-STD-040 ABL Heatsinks
BGA-STD-120 ABL Heatsinks
BGA-PP-025 ABL Heatsinks
BGA-STD-115 ABL Heatsinks