658-35AB

658 系列 27.9 x 27.9 x 8.9 mm 3° C/W 热阻 全方向 散热片

Omnidirectional Pin Fin Heat Sink for BGAs and PowerPC™

得捷:
HEATSINK CPU 28MM SQBLK W/O TAPE

Allied Electronics:
Omnidirectional Pin Fin Heat Sink for 27mm BGA & Power PC

Newark:
# WAKEFIELD SOLUTIONS  658-35AB  Heat Sink, For Ball Grid Array, Black Anodized, BGA, 8.9 mm, 27.9 mm, 27.9 mm

MASTER:
Heat Sink Passive BGA Pin Array Adhesive Black Anodized

Electro Sonic:
Heat Sink Passive BGA Pin Array Adhesive Black Anodized