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658-25AB

658 系列 27.9 x 27.9 x 6.4 mm 5° C/W 热阻 全方向 散热片

Omnidirectional Pin Fin Heat Sink for BGAs and PowerPC™


得捷:
HEATSINK CPU 28MM SQ BLK


贸泽:
散热片 HEATSINK


Allied Electronics:
Heatsink; Omnidirectional; 27mm; 6.4mm; 5C/W


富昌:
658 Series 27.9 x 27.9 x 6.4 mm 5° C/W Resistance Omnidirectional Heat Sink


Chip1Stop:
Heat Sink Passive BGA Pin Array Adhesive Black Anodized


Verical:
Heat Sink Passive BGA Pin Array Adhesive Black Anodized


MASTER:
Heat Sink Passive BGA Pin Array Adhesive Black Anodized


Electro Sonic:
Heat Sink Passive BGA Pin Array Adhesive Black Anodized


658-25AB PDF数据文档
图片 型号 厂商 下载
658-25AB Wakefield Engineering
658-60ABT4E Wakefield Engineering
658-35ABT4E Wakefield Engineering
658-45ABT3 Wakefield Engineering
658-45ABT1E Wakefield Engineering
658-45ABT5 Wakefield Engineering
658-60ABT6 Wakefield Engineering
658-25ABT5 Wakefield Engineering
658-35ABT5 Wakefield Engineering
658-35ABT3 Wakefield Engineering
658-25ABT2 Wakefield Engineering