BZV55C7V5
无铅封装用于表面安装 LEADLESS PACKAGE FOR SURFACE MOUNT
FEATURES: • ZENER DIODES • LEADLESS PACKAGE FOR SURFACE MOUNT • DOUBLE PLUG CONSTRUCTION • METALLURGICALLY BONDED
艾睿:
Diode Zener Single 7.45V 5% 500mW 2-Pin DO-213AA Bag
无铅封装用于表面安装 LEADLESS PACKAGE FOR SURFACE MOUNT
FEATURES: • ZENER DIODES • LEADLESS PACKAGE FOR SURFACE MOUNT • DOUBLE PLUG CONSTRUCTION • METALLURGICALLY BONDED
艾睿:
Diode Zener Single 7.45V 5% 500mW 2-Pin DO-213AA Bag
图片 | 型号 | 厂商 | 下载 |
---|---|---|---|
![]() | BZV55C7V5 | Microsemi 美高森美 | |
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![]() | BZV55C10 L1 | Taiwan Semiconductor 台湾半导体 |