TW-E40-1020-P

Breadboard; Solderless; Polyoxymethylene; 150deg; 830 tie points; 2.1 x 6.5in.

无焊剂试验电路板 端子条（无框架） 6.50" x 2.14"（165.1mm x 54.4mm）

得捷:
BREADBOARD HIGH TEMP 6.50X2.14"

艾睿:
Polyoxymethylene 830 Tie Point Breadboard

Allied Electronics:
Breadboard; Solderless; Polyoxymethylene; 150 deg; 830 tie points; 2.1 x 6.5 in.