TW-E40-510-P

Breadboard; Solderless; Polyoxymethylene; 150deg; 460 tie points; 2.1 x 3.3in.

无焊剂试验电路板 端子条（无框架） 3.30" x 2.14"（83.8mm x 54.4mm）

得捷:
BREADBOARD HIGH TEMP 3.30X2.14"

贸泽:
PCBs & Breadboards 460 TIE POINTS POM 2.1"X3.3"

艾睿:
High Temperature 400 Tie Point Breadboard

Allied Electronics:
Breadboard; Solderless; Polyoxymethylene; 150 deg; 460 tie points; 2.1 x 3.3 in.