BZV55C33
无铅封装用于表面安装 LEADLESS PACKAGE FOR SURFACE MOUNT
FEATURES: • ZENER DIODES • LEADLESS PACKAGE FOR SURFACE MOUNT • DOUBLE PLUG CONSTRUCTION • METALLURGICALLY BONDED
艾睿:
Diode Zener Single 33V 5% 500mW 2-Pin DO-213AA Bag
Win Source:
DIODE ZENER 33V DO213AA