605SJR00800
0.008Ω ±5% 0.5W1/2W ±100ppm/℃
±5% 0.5W,1/2W 芯片 带状,L 形弯曲 电流感应,耐燃,防潮,安全 金属元素
得捷:
RES 0.008 OHM 5% 1/2W L BEND
Electro Sonic:
Res Metal Plate 0.008 Ohm 5% 0.5W1/2W ±100ppm/°C Bare Metal J-Lead SMD
0.008Ω ±5% 0.5W1/2W ±100ppm/℃
±5% 0.5W,1/2W 芯片 带状,L 形弯曲 电流感应,耐燃,防潮,安全 金属元素
得捷:
RES 0.008 OHM 5% 1/2W L BEND
Electro Sonic:
Res Metal Plate 0.008 Ohm 5% 0.5W1/2W ±100ppm/°C Bare Metal J-Lead SMD
图片 | 型号 | 厂商 | 下载 |
---|---|---|---|
605SJR00800 | Ohmite | ||
605SJR00200E | Ohmite | ||
605SJR00800E | Ohmite | ||
605SJR00500E | Ohmite | ||
605SJR00375E | Ohmite | ||
605SJR00200E-T | Ohmite | ||
605SJR00500E-T | Ohmite | ||
605SJR00800E-T | Ohmite | ||
605SJR00375-T | Ohmite | ||
605SJR00200 | Ohmite | ||
605SJR00500-T | Ohmite |