605SJR00200E-T

0.002Ω ±5% 0.5W1/2W ±100ppm/℃

**Features**

* Superior Thermal Expansion Cycling

* Inductance Less Than 10 Nanohenries

* Flameproof

* Solderable Pads: Tin Sn Plate

* Flexible for Thermal Expansion

* Low Termination Stress “J” Terminals

* Shape Provides Cooler Operation

* Custom Values Available **Applications**

* Current Sensing

* Low Inductance

* AC Applications

* Feedback

* Surge and Pulse

得捷:
RES 0.002 OHM 5% 1/2W L BEND

Allied Electronics:
Resistor; Metal Film; Res 0.002 Ohms; Pwr-Rtg 0.5 W; Tol 5%; SMT; TR

Electro Sonic:
Res Metal Plate 0.002 Ohm 5% 0.5W1/2W ±100ppm/°C Pad SMD T/R