F3L15R12W2H3_B27

EasyPACK™ 2B 1200V 3-level NPC2 full-bridge IGBT module with NTC, High Speed IGBT H3 and PressFIT Contact Technology

Summary of Features:

.

Low inductive design

.

Low Switching Losses

.

Low VCEsat

.

Al2O3 Substrate with Low Thermal Resistance

.

Compact design

.

PressFIT Contact Technology

.

Rugged mounting due to integrated mounting clamps

Benefits:

.

Compact module concept

.

Optimized customer’s development cycle time and cost

.

Configuration flexibility