FS75R12W2T4

EasyPACK模块海沟/场终止IGBT 4和发射极控制二极管4和压接/ NTC EasyPACK module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and PressFIT / NTC

Summary of Features:

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Low Switching Losses

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Trench IGBT 4

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VCEsat with positive Temperature Coefficient

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Low VCEsat

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Al2O3 Substrate with Low Thermal Restistance

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Compact Design

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Solder Contact Technology

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Rugged mounting due to integrated mounting clamps

Benefits:

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Compact module concept

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Optimized customer’s development cycle time and cost

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Configuration flexibility