RE012-LF
1.27 mm 节距 原型开发板 SMD 环氧玻璃纤维 1.50 mm 单面 35 μm 铜 热空气调平(HAL 无铅) 焊接停止掩膜 孔间隔 1,27 x 1,27 mm DIN 类型矩阵板 矩阵板,带有 1 mm 的孔,节距为 2.54 mm。
The is a 39.37 x 38.1mm SMD-Labcard dual inline Prototyping Board, made of 1.5mm epoxy fibreglass and 35µm Cu single-sided construction with solder stop mask surface. This hot air levelling prototyping board comes with 27 x 27 1 x 1mm soldering pads.
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- 0.45mm Hole diameter
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- 1.27 x 1.27mm Hole spacing
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- Lead-free hot air levelling