RE012-LF

1.27 mm 节距 原型开发板 SMD 环氧玻璃纤维 1.50 mm 单面 35 μm 铜 热空气调平（HAL 无铅） 焊接停止掩膜 孔间隔 1,27 x 1,27 mm DIN 类型矩阵板 矩阵板，带有 1 mm 的孔，节距为 2.54 mm。

The is a 39.37 x 38.1mm SMD-Labcard dual inline Prototyping Board, made of 1.5mm epoxy fibreglass and 35µm Cu single-sided construction with solder stop mask surface. This hot air levelling prototyping board comes with 27 x 27 1 x 1mm soldering pads.

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0.45mm Hole diameter

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1.27 x 1.27mm Hole spacing

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Lead-free hot air levelling