658-25ABT3

658 系列 27.9 x 27.9 x 6.4 mm 5° C/W 热阻 全方向 散热片

散热片 BGA 铝 2.0W @ 40°C 顶部安装

得捷:
HEATSINK CPU 28MM SQ BLK W/TAPE

贸泽:
Heat Sinks 27mm BGA H/S 1.10X.25 w/T412

Allied Electronics:
Omnidirectional Pin Fin Heat Sink for 27mm BGA & Power PC

Verical:
Heat Sink Passive BGA Pin Array Adhesive Black Anodized

Newark:
# WAKEFIELD SOLUTIONS  658-25ABT3  Heat Sink, Square, For Ball Grid Arrays, Penguin Cooler, Pin Fin, BGA, 6.4 mm, 27.9 mm, 27.9 mm

MASTER:
Heat Sink Passive BGA Pin Array Adhesive Black Anodized

Electro Sonic:
Heat Sink Passive BGA Pin Array Adhesive Black Anodized