374724B00032G

BGA 15.3 °C/W 热阻 35 x 35 x 18 mm 黑色阳极氧化 散热片

The is a white pin-fin Heat Sink with tape attachment suitable for FPGA/BGA packages. It is made of aluminium with black anodize finish.

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Tape mounting saves board space by eliminating mounting holes

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Convenient peel and stick assembly is quick and clean

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Pin-fin array allows omnidirectional airflow to maximize heat dissipation

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Comes with T405R Chomerics tape for metal surface

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Acrylic adhesive