| | | | | 厂家: - 转换自(适配器端): AT90PWM2 安装类型: - 间距-配接: - 触头表面处理-柱: - |
| | | | | 厂家: - 转换自(适配器端): SOIC-W 安装类型: Through Hole 间距-配接: 0.050" (1.27mm) 触头表面处理-柱: Gold |
| | | | | 厂家: - 转换自(适配器端): - 安装类型: - 间距-配接: - 触头表面处理-柱: - |
| | | | | 厂家: - 转换自(适配器端): - 安装类型: - 间距-配接: - 触头表面处理-柱: - |
| | | | | 厂家: - 转换自(适配器端): TSOP 安装类型: Through Hole 间距-配接: 0.020" (0.50mm) 触头表面处理-柱: Tin-Lead |
| | | | | 厂家: - 转换自(适配器端): DIP, 0.3" (7.62mm) Row Spacing 安装类型: Surface Mount 间距-配接: - 触头表面处理-柱: Gold |
| | | | | 厂家: - 转换自(适配器端): TQFP 安装类型: Through Hole 间距-配接: 0.031" (0.80mm) 触头表面处理-柱: Tin-Lead |
| | | | | 厂家: - 转换自(适配器端): DIP, 0.6" (15.24mm) Row Spacing 安装类型: Through Hole 间距-配接: 0.100" (2.54mm) 触头表面处理-柱: Gold |
| | | | | 厂家: - 转换自(适配器端): DIP, 0.6" (15.24mm) Row Spacing 安装类型: Through Hole 间距-配接: 0.100" (2.54mm) 触头表面处理-柱: Gold |
| | | | | 厂家: - 转换自(适配器端): SSOP 安装类型: Through Hole 间距-配接: 0.026" (0.65mm) 触头表面处理-柱: Gold |
| | | | | 厂家: - 转换自(适配器端): SIP 安装类型: - 间距-配接: - 触头表面处理-柱: - |
| | | | | 厂家: - 转换自(适配器端): PLCC 安装类型: Through Hole 间距-配接: 0.050" (1.27mm) 触头表面处理-柱: Tin-Lead |
| | | | | 厂家: - 转换自(适配器端): QFP 安装类型: Through Hole 间距-配接: 0.031" (0.80mm) 触头表面处理-柱: Tin-Lead |
| | | | | 厂家: - 转换自(适配器端): QFP 安装类型: Through Hole 间距-配接: 0.025" (0.64mm) 触头表面处理-柱: Tin-Lead |
| | | | | 厂家: - 转换自(适配器端): QFP 安装类型: Through Hole 间距-配接: 0.031" (0.80mm) 触头表面处理-柱: Tin-Lead |
| | | | | 厂家: - 转换自(适配器端): QFP 安装类型: Through Hole 间距-配接: 0.026" (0.65mm) 触头表面处理-柱: Tin-Lead |
| | | | | 厂家: - 转换自(适配器端): QFP 安装类型: - 间距-配接: - 触头表面处理-柱: - |
| | | | | 厂家: - 转换自(适配器端): DIP, 0.4" (10.16mm) Row Spacing 安装类型: Through Hole 间距-配接: 0.070" (1.78mm) 触头表面处理-柱: Gold |
| | | | | 厂家: - 转换自(适配器端): SOIC 安装类型: Surface Mount 间距-配接: 0.050" (1.27mm) 触头表面处理-柱: Tin-Lead |
| | | | | 厂家: - 转换自(适配器端): DIP, 0.6" (15.24mm) Row Spacing 安装类型: Through Hole 间距-配接: 0.100" (2.54mm) 触头表面处理-柱: Tin |
| | | | | 厂家: - 转换自(适配器端): DIP, 0.3" (7.62mm) Row Spacing 安装类型: Through Hole 间距-配接: 0.100" (2.54mm) 触头表面处理-柱: Tin |
| | | | | 厂家: - 转换自(适配器端): SOIC-W 安装类型: Through Hole 间距-配接: 0.050" (1.27mm) 触头表面处理-柱: Tin-Lead |
| | | | | 厂家: - 转换自(适配器端): SOIC 安装类型: Through Hole 间距-配接: 0.050" (1.27mm) 触头表面处理-柱: Tin-Lead |
| | | | | 厂家: - 转换自(适配器端): SOIC 安装类型: Through Hole 间距-配接: 0.050" (1.27mm) 触头表面处理-柱: Tin-Lead |
| | | | | 厂家: - 转换自(适配器端): PLCC 安装类型: Through Hole 间距-配接: 0.050" (1.27mm) 触头表面处理-柱: Tin-Lead |
| | | | | 厂家: - 转换自(适配器端): SOIC 安装类型: Surface Mount 间距-配接: 0.050" (1.27mm) 触头表面处理-柱: Tin-Lead |
| | | | | 厂家: - 转换自(适配器端): SOIC 安装类型: Surface Mount 间距-配接: 0.050" (1.27mm) 触头表面处理-柱: Tin-Lead |
| | | | | 厂家: - 转换自(适配器端): PLCC 安装类型: Through Hole 间距-配接: 0.050" (1.27mm) 触头表面处理-柱: Gold |
| | | | | 厂家: - 转换自(适配器端): SOIC-W 安装类型: Through Hole 间距-配接: 0.050" (1.27mm) 触头表面处理-柱: Tin-Lead |
| | | | | 厂家: - 转换自(适配器端): SOIC 安装类型: Through Hole 间距-配接: 0.050" (1.27mm) 触头表面处理-柱: Tin-Lead |
| | | | | 厂家: - 转换自(适配器端): SOIC 安装类型: Surface Mount 间距-配接: 0.050" (1.27mm) 触头表面处理-柱: Tin-Lead |
| | | | | 厂家: - 转换自(适配器端): SOIC 安装类型: Surface Mount 间距-配接: 0.050" (1.27mm) 触头表面处理-柱: Tin-Lead |
| | | | | 厂家: - 转换自(适配器端): PLCC 安装类型: Through Hole 间距-配接: 0.050" (1.27mm) 触头表面处理-柱: Tin-Lead |
| | | | | 厂家: - 转换自(适配器端): SOIC 安装类型: Surface Mount 间距-配接: 0.050" (1.27mm) 触头表面处理-柱: Tin-Lead |
| | | | | 厂家: - 转换自(适配器端): PLCC 安装类型: Through Hole 间距-配接: 0.050" (1.27mm) 触头表面处理-柱: Tin-Lead |
| | | | | 厂家: - 转换自(适配器端): SOIC 安装类型: Surface Mount 间距-配接: 0.050" (1.27mm) 触头表面处理-柱: Tin-Lead |
| | | | | 厂家: - 转换自(适配器端): MSOP 安装类型: Through Hole 间距-配接: 0.020" (0.50mm) 触头表面处理-柱: Tin-Lead |
| | | | | 厂家: - 转换自(适配器端): PLCC 安装类型: Through Hole 间距-配接: 0.050" (1.27mm) 触头表面处理-柱: Tin-Lead |
| | | | | 厂家: - 转换自(适配器端): DIP, 0.3" (7.62mm) Row Spacing 安装类型: Through Hole 间距-配接: 0.100" (2.54mm) 触头表面处理-柱: Tin-Lead |
| | | | | 厂家: - 转换自(适配器端): PLCC 安装类型: Through Hole 间距-配接: 0.050" (1.27mm) 触头表面处理-柱: Tin-Lead |
| | | | | 厂家: - 转换自(适配器端): SOIC-W 安装类型: Through Hole 间距-配接: 0.050" (1.27mm) 触头表面处理-柱: Tin-Lead |
| | | | | 厂家: - 转换自(适配器端): DIP, 0.6" (15.24mm) Row Spacing 安装类型: Through Hole 间距-配接: 0.100" (2.54mm) 触头表面处理-柱: Tin |
| | | | | 厂家: - 转换自(适配器端): DIP, 0.6" (15.24mm) Row Spacing 安装类型: Through Hole 间距-配接: 0.100" (2.54mm) 触头表面处理-柱: Tin |
| | | | | 厂家: - 转换自(适配器端): DIP, 0.3" (7.62mm) Row Spacing 安装类型: Through Hole 间距-配接: 0.100" (2.54mm) 触头表面处理-柱: Tin |
| | | | | 厂家: - 转换自(适配器端): DIP, 0.6" (15.24mm) Row Spacing 安装类型: Through Hole 间距-配接: 0.100" (2.54mm) 触头表面处理-柱: Tin |
| | | | | 厂家: - 转换自(适配器端): DIP, 0.3" (7.62mm) Row Spacing 安装类型: Through Hole 间距-配接: 0.100" (2.54mm) 触头表面处理-柱: Tin |
| | | | | 厂家: - 转换自(适配器端): MSOP 安装类型: Through Hole 间距-配接: 0.020" (0.50mm) 触头表面处理-柱: Tin-Lead |
| | | | | 厂家: - 转换自(适配器端): DIP, 0.6" (15.24mm) Row Spacing 安装类型: Through Hole 间距-配接: 0.100" (2.54mm) 触头表面处理-柱: Tin |
| | | | | 厂家: - 转换自(适配器端): DIP, 0.3" (7.62mm) Row Spacing 安装类型: Through Hole 间距-配接: 0.100" (2.54mm) 触头表面处理-柱: Tin |
| | | | | 厂家: - 转换自(适配器端): DIP, 0.6" (15.24mm) Row Spacing 安装类型: Through Hole 间距-配接: 0.100" (2.54mm) 触头表面处理-柱: Tin |