| | SMD TERMINATOR 10W 50OHM 3GHZ 射频IC模块 | | | 厂家: - 系列: - RF 类型: - 安装类型: Surface Mount 封装/外壳: 2-SMD, No Lead 供应商器件封装: - |
| | SMD TERMINATOR 10W 50OHM 3GHZ 射频IC模块 | | | 厂家: - 系列: - RF 类型: - 安装类型: Surface Mount 封装/外壳: 2-SMD, No Lead 供应商器件封装: - |
| | SMD TERMINATOR 10W 50OHM 3GHZ 射频IC模块 | | | 厂家: - 系列: - RF 类型: - 安装类型: Surface Mount 封装/外壳: 2-SMD, No Lead 供应商器件封装: - |
| | FLANGE MOUNT TERMINATION 射频IC模块 | | | 厂家: - 系列: - RF 类型: Cellular, DCS, GSM, PCS, UMTS 安装类型: Flange Mount 封装/外壳: Module 供应商器件封装: 0502 |
| | FLANGE MOUNT TERMINATION 射频IC模块 | | | 厂家: - 系列: - RF 类型: Cellular, DCS, GSM, PCS, UMTS 安装类型: Flange Mount 封装/外壳: Module 供应商器件封装: - |
| | DOHERTY COMBINER 920-960MHZ SMD 射频IC模块 | | | 厂家: - 系列: Xinger III® RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 4-SMD, No Lead 供应商器件封装: SMD |
| | DOHERTY COMBINER 862-894MHZ SMD 射频IC模块 | | | 厂家: - 系列: Xinger III® RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 4-SMD, No Lead 供应商器件封装: SMD |
| | DOHERTY COMBINER 3500-3600MHZ 射频IC模块 | | | 厂家: - 系列: Xinger III® RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 4-SMD, No Lead 供应商器件封装: - |
| | DOHERTY COMBINER 2580-2730MHZ 射频IC模块 | | | 厂家: - 系列: Xinger III® RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 4-SMD, No Lead 供应商器件封装: - |
| | DOHERTY COMBINER 2300-2400MHZ 射频IC模块 | | | 厂家: - 系列: Xinger III® RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 4-SMD, No Lead 供应商器件封装: - |
| | DOHERTY COMBINER 2100-2200 射频IC模块 | | | 厂家: - 系列: Xinger III® RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 4-SMD, No Lead 供应商器件封装: - |
| | | | | 厂家: - 系列: - RF 类型: - 安装类型: Surface Mount 封装/外壳: 2-SMD, No Lead Exposed Pad 供应商器件封装: - |
| | DOHERTY COMBINER 1805-1920MHZ 射频IC模块 | | | 厂家: - 系列: Xinger III® RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 4-SMD, No Lead 供应商器件封装: - |
| | DOHERTY COMBINER 728-768MHZ SMD 射频IC模块 | | | 厂家: - 系列: Xinger III® RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 4-SMD, No Lead 供应商器件封装: - |
| | TERMINATION 50 OHM 8W SMD 射频IC模块 | | | 厂家: - 系列: - RF 类型: GSM, DCS, PCS 安装类型: Surface Mount 封装/外壳: 1206 (3216 Metric) 供应商器件封装: 1206 |
| | DOHERTY COMBINR 1805-1880MHZ SMD 射频IC模块 | | | 厂家: - 系列: Xinger III® RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 4-SMD, No Lead 供应商器件封装: SMD |
| | DOHERTY COMBINR 1805-1880MHZ SMD 射频IC模块 | | | 厂家: - 系列: Xinger III® RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 4-SMD, No Lead 供应商器件封装: SMD |
| | DOHERTY COMBINR 1805-1880MHZ SMD 射频IC模块 | | | 厂家: - 系列: Xinger III® RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 4-SMD, No Lead 供应商器件封装: SMD |
| | DOHERTY COMBINR 1930-1990MHZ SMD 射频IC模块 | | | 厂家: - 系列: Xinger III® RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 4-SMD, No Lead 供应商器件封装: SMD |
| | DOHERTY COMBINR 1930-1990MHZ SMD 射频IC模块 | | | 厂家: - 系列: Xinger III® RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 4-SMD, No Lead 供应商器件封装: SMD |
| | DOHERTY COMBINR 1930-1990MHZ SMD 射频IC模块 | | | 厂家: - 系列: Xinger III® RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 4-SMD, No Lead 供应商器件封装: SMD |
| | DOHERTY COMBINR 2110-2170MHZ SMD 射频IC模块 | | | 厂家: - 系列: Xinger III® RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 4-SMD, No Lead 供应商器件封装: SMD |
| | DOHERTY COMBINR 2110-2170MHZ SMD 射频IC模块 | | | 厂家: - 系列: Xinger III® RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 4-SMD, No Lead 供应商器件封装: SMD |
| | DOHERTY COMBINR 2110-2170MHZ SMD 射频IC模块 | | | 厂家: - 系列: Xinger III® RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 4-SMD, No Lead 供应商器件封装: SMD |
| | DOHERTY COMBINER 728-768MHZ SMD 射频IC模块 | | | 厂家: - 系列: Xinger III® RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 4-SMD, No Lead 供应商器件封装: SMD |
| | DOHERTY COMBINER 728-768MHZ SMD 射频IC模块 | | | 厂家: - 系列: Xinger III® RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 4-SMD, No Lead 供应商器件封装: SMD |
| | DOHERTY COMBINER 728-768MHZ SMD 射频IC模块 | | | 厂家: - 系列: Xinger III® RF 类型: General Purpose 安装类型: Surface Mount 封装/外壳: 4-SMD, No Lead 供应商器件封装: SMD |
| | RF POWER DIVIDER 0HZ-6GHZ 6SMD 射频IC模块 | | | 厂家: - 系列: Xinger® RF 类型: - 安装类型: Surface Mount 封装/外壳: 6-SMD, No Leads 供应商器件封装: - |
| | RF POWER DIVIDER 0HZ-6GHZ 6SMD 射频IC模块 | | | 厂家: - 系列: Xinger® RF 类型: - 安装类型: Surface Mount 封装/外壳: 6-SMD, No Leads 供应商器件封装: - |