72T18125L5BBI、IDT72T18125L10BB、72T18125L10BB对比区别

高亮显示差异参数

型号 72T18125L5BBI IDT72T18125L10BB 72T18125L10BB

描述 FIFO Mem Async/Sync Dual Depth/Width Uni-Dir 512K x 18/1M x 9 240Pin BGA2.5 VOLT HIGH -SPEED TeraSync FIFO的18位/ 9位配置 2.5 VOLT HIGH-SPEED TeraSync FIFO 18-BIT/9-BIT CONFIGURATIONSFIFO Mem Async/Sync Dual Depth/Width Uni-Dir 512K x 18/1M x 9 240Pin BGA

数据手册 ---

制造商 Integrated Device Technology (艾迪悌) Integrated Device Technology (艾迪悌) Integrated Device Technology (艾迪悌)

分类 FIFOFIFOFIFO

安装方式 Surface Mount Surface Mount Surface Mount

引脚数 240 - 240

封装 BGA-240 BGA-240 BGA-240

存取时间 5 ns - 14ns, 4.5ns

工作温度(Max) 85 ℃ - -

工作温度(Min) -40 ℃ - -

电源电压 2.375V ~ 2.625V - 2.375V ~ 2.625V

电源电压(Max) 2.625 V - -

电源电压(Min) 2.375 V - -

长度 19.0 mm - 19.0 mm

宽度 19 mm - 19.0 mm

封装 BGA-240 BGA-240 BGA-240

厚度 1.76 mm - 1.76 mm

工作温度 -40℃ ~ 85℃ - 0℃ ~ 70℃

产品生命周期 Active Unknown Active

包装方式 Tray Tray Tray

RoHS标准 Non-Compliant Non-Compliant Non-Compliant

含铅标准 Contains Lead Contains Lead Contains Lead

ECCN代码 EAR99 EAR99 -