MPXC2011DT1

NXP  MPXC2011DT1  压力传感器, 差分, 2.5 mV/kPa, 0 kPa, 10 kPa, 3 V, 10 V

The is a high volume Pressure Sensor which is ideal as a sub-module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while providing an economic solution for the designer. This new chip carrier package uses Freescale Semiconductor"s unique sensor die with its piezoresistive technology, along with the added feature of on-chip, thin-film temperature compensation and calibration.

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Integrated temperature compensation and calibration

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Ratiometric to supply voltage