625-35AB
625 系列 25 x 25 x 8.9 mm 方形 黑色阳极氧化 全方向 散热片
The 625 Series is an omnidirectional pin fin heat sink for both natural and forced-convection applications. Applications include network routers and switches, high-resolution printers, digital cameras, consumer video games, digital video disks DVD and global positioning systems GPS.
得捷:
HEATSINK FOR 25MM BGA
Allied Electronics:
Omnidirectional Pin Fin Heat Sink for 21mmBGA; Super BGA; PBGA; FPBGA
Chip1Stop:
Heat Sink Passive BGA Pin Array Adhesive Aluminum Black Anodized
Verical:
Heat Sink Passive BGA Pin Array Adhesive Aluminum Black Anodized
MASTER:
Heat Sink Passive BGA Pin Array Adhesive Aluminum Black Anodized
Electro Sonic:
Heat Sink Passive BGA Pin Array Adhesive Aluminum Black Anodized
