ATS-51300K-C1-R0

散热片 maxiFLOW BGA Heatsink with maxiGRIP Attachment, Low Profile, 30x30x14.5mm, 53.3mm Fin Tip

散热片 BGA 铝 - 顶部安装

得捷:
HEAT SINK 30MM X 30MM X 14.5MM

贸泽:
散热片 maxiFLOW BGA Heatsink with maxiGRIP Attachment, Low Profile, 30x30x14.5mm, 53.3mm Fin Tip

艾睿:
Heat Sink Passive BGA Spread Clip 4.33°C/W Black Anodized

Verical:
Heat Sink Passive BGA Spread Clip Aluminum 4.33C/W Black Anodized

AMEYA360:
HEAT SINK 30MM X 30MM X 14.5MM