TA203PA10R0J

10Ω ±5% 3W ±100ppm/℃

Power Chip® Thick Film on Alumina Substrate

’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package configuration which dissipates heat well above board level.

Ohmite’s power chip resis tors have a 125% higher operating temperature range than competitive product of similar design. High temperature solder and in-process plating keep terminations secure under self-heating effects by preventing re-flow from full power operation.

Flexible packaging schemes make these resistors ideal for power supplies, audio amplifiers, video fly-back, and other power control applications.

FeATureS

• High-Temp Terminal Construction

• Wide Resistance Range

• Low Inductance 50nH-100nH

• High Power Density

• Easy to install. PC-mountable