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CONN SCKT ILM ASSEM FOR LGA2011

Approved by Intel and supporting its top-of-the-line Core i7 series processors, the compact LGA 2011-0 CPU socket meets the reliability requirements for target processor performance levels of servers, workstations and high-end PCs Augmenting ’s CPU socket solutions and replacing the LGA 1366, the Intel-approved LGA 2011-0 socket Socket R offers the electrical, mechanical and thermal reliability enterprise servers, workstations and high-end PCs need to reach target performance levels of Intel’s Core

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i7 series of 32nm-Sandy Bridge-E microprocessors.

Molex’s LGA 2011-0 socket features a fully loaded Interstitial Seating Plane ISP design for improved contact reliability by preventing circuit opens and shorts caused by contact deformation during a package overload. The socket uses high strength, copper alloy contacts for robust performance. Socket terminals are oriented at angles that reduce the risk of cross-contact during processor overloads ‘over compression’.

The LGA 2011-0 socket assembly uses a larger backplate than the LGA 1366 or LGA1156 sockets and is not backward compatible for use with any other processors and their ILM assemblies. The socket is used with two ILM designs – a Standard Square and a Narrow ILM assembly. The Standard ILM has a larger 80 by 80 mm keep-out zone than that 56 by 94 mm of the Narrow ILM. The assemblies contain the same set of components and are assembled in the same way, however the position of their threaded heatsink mounting studs and the design of their ILM levers are noticeably different.

Molex offers 15 or 30 micron gold Au-plated contact sockets that come with pick-and-place covers for easy placement in automated board assembly. All sockets are shipped in JEDEC-type hard trays.