UCC3915

0-3A、7-15V 单路热插拔 IC 高侧 MOSFET、休眠模式下 100uA IQ、商用温度

The programmable hot swap power manager provides complete power-management, hot-swap capability, and circuit breaker functions. The only external component required to operate the device, other than power supply bypassing, is the fault-timing capacitor, CT. All control and housekeeping functions are integrated, and externally programmable. These include the fault current level, maximum output sourcing current, maximum fault time, and startup delay. In the event of a constant fault, the internal fixed 2% duty cycle ratio limits average output power.

The internal 4-bit DAC allows programming of the fault-level current from 0 A to 3 A with 0.25-A resolution. The IMAX control pin sets the maximum-sourcing current to 1 A above the trip level or to a full 4 A of output current for fast output capacitor charging.

When the output current is below the fault level, the output MOSFET is switched on with a nominal ON resistance of 0.15 . When the output current exceeds the fault level, but is less than the maximum-sourcing level, the output remains switched on, but the fault timer starts, charging CT. Once CT charges to a preset threshold, the switch is turned off, and remains off for 50 times the programmed fault time. When the output current reaches the maximum sourcing level, the MOSFET transitions from a switch to a constant current source.

The UCC3915 can be put into sleep mode, drawing only 100 uA of supply current. Other features include an open-drain fault-output indicator, thermal shutdown, undervoltage lockout, 7-V to 15-V operation, and low-thermal resistance SOIC and TSSOP power packages.

.

Integrated 0.15- Power MOSFET

.

7-V to 15-V Operation

.

Digital-Programmable Current Limit from 0 A to 3 A

.

100-uA ICC When Disabled

.

Programmable On Time

.

Programmable Start Delay

.

Fixed 2% Duty Cycle

.

Thermal Shutdown

.

Fault-Output Indicator

.

Maximum-Output Current Can Be Set to 1 A Above the Programmed-Fault Level or to a Full 4 A

.

Power SOIC and TSSOP, Low Thermal Resistance Packaging