RS08KA2 PROMO

The RS08 平台 is developed 用于extremely 低成本应用. Its 硬件 size is optimized和the overall 系统 cost is reduced. The smaller 硬件 size allows the silicon to fit into a smaller封装, 如 the 6-pin dual flat no lead封装 DFN. The RS08 平台 retains a similar编程model as in the popular HC08/S08 平台s to allow easy source code migration between the 平台s. This电路板 allows the 功能 of the MCU to be demonstrated easily和quickly和can assist when debugging和programming, reducing 开发 time.

The RS08 平台 is developed 用于extremely 低成本应用. Its 硬件 size is optimized和the overall 系统 cost is reduced. The smaller 硬件 size allows the silicon to fit into a smaller封装, 如 the 6-pin dual flat no lead封装 DFN. The RS08 平台 retains a similar编程model as in the popular HC08/S08 平台s to allow easy source code migration between the 平台s. This电路板 allows the 功能 of the MCU to be demonstrated easily和quickly和can assist when debugging和programming, reducing 开发 time.

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内置USB至BDM接口

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BDM针座连接器