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RE943-S1

ROTH ELEKTRONIK  RE943-S1  面包板, 可焊接, 环氧玻璃纤维, 1.5mm, 31.75mm x 27.3mm

The is a 31.75 x 27.3mm solderable Breadboard, made of 1.5mm fibreglass and 35µm Cu double-sided construction with solder stop mask and plated through holes. This hot air levelling adaption circuit board features 2 x 8 two-hole-pads on each side and U-shape potential strip. This adaption circuit board suits for 16-pin sockets with a 7.62mm distance.

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2.54mm Hole spacing
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Lead-free hot air levelling

RE943-S1 PDF数据文档
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