ENW-89811A6KF

PANASONIC ELECTRONIC COMPONENTS  ENW-89811A6KF  无线模块, 蓝牙2.0, EDR+天线, PAN1321I

PAN1311/1321 in comparison to the pin compatible HCI solution PAN1310/1320, a powerful host is no longer needed. The PAN1311/1321 is manufactured in a 15.6 x 8.7 x 2.8 mm³ SMD LGA package with shielded case and will be qualified to the Bluetooth 2.0 standard. Due to a very low price PAN1311/1321 is well suited for units produced in all quantities; with the simple AT command set, PAN1311/1321 can be easily integrated into your application. This module follows the national and international regulations, e.g. EMC, Safety, EN300328, FCC.

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PAN1321-SPP, with Antenna

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Complete Bluetooth 2.1 + EDR solution

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Supported Profiles: RFCOMM, SPP device A and B

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Ultra low power design

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No external components needed

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Integrates ARM7TDMI, RAM and patchable 256k EEPROM

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Low power clock from internal oscillator or external low power clock