A15196-02

LAIRD TECHNOLOGIES  A15196-02  热缝隙填充, 229 X 229MM, 0.5MM

The is a 0.5mm Thermal Gap Filler with great thermal performance and high compliancy. The soft interface pad conforms to component topography, resulting in little or no stress on the components and mating chassis or parts. Unique silicone and ceramic filler technology allows a combination of high compliancy and high thermal performance. It is suitable for use with cooling components to chassis, frame or other mating components, mass storage devices, flat panel displays and GPS navigation and other portable devices applications.

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Highly compliant

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Low thermal resistance even at low pressure

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Naturally tacky for adhesion during assembly and transport

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UL94V-0 Flammability rating

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±10% Thickness tolerance

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-45 to 200°C Operating temperature

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1.0% Out-gassing TML

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0.13% Out-gassing CVCM