SW16015

CHEMTRONICS  SW16015  吸锡编织带, 0.9MM 10只/包

The is a Soder-Wick® No Clean Desoldering Braid designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick® No Clean uses pure, oxygen-free copper braid and a patented flux technology to make an efficient and effective desoldering braid. Soder-Wick® No Clean SD is available on ESD safe bobbins for protection against damage due to static electricity. The Soder-Wick® No Clean SD safely removes solder in all applications requiring type ROL0 flux. BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes. The Soder-Wick® No Clean safely removes solder from micro circuits, surface mount device pads, ball grid array pads, lugs and posts.

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White label on SD bobbin

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Minimizes the risk of damage associated with static electricity

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Patented non-corrosive, halide-free and organic no-clean flux

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Desolders up to 40% faster than competitive no-clean braids and leaves boards cleaner

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Requires little or no post solder cleaning

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No corrosive residues

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Minimal risk of heat and static component damage

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Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for surface insulation resistance

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Packaged in ESD-safe static dissipative bobbins