904-27-1-33-2-B-0

Heatsink; Eliptical Pin with clip assembly; 27 x 32.6mm

Wakefield-Vette’s 900 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola and many more. These heat sinks are designed for air flow applications in the Telecom, Data Center, Networking, and Cloud Computing Industries.

得捷:
HEAT SINK ELLIP FIN 27X27MM CLIP

Allied Electronics:
Heatsink; Eliptical Pin with clip assembly; 27 x 32.6 mm

904-27-1-33-2-B-0详细参数

904-27-1-33-2-B-0 PDF数据文档

图片	型号	厂商	下载
	904-27-1-33-2-B-0	Wakefield Engineering
	904-126	Littelfuse 力特
	904-216-001	Littelfuse 力特
	904-187	Bivar
	904-27-2-33-2-B-0	Wakefield Engineering
	904-27-2-12-2-B-0	Wakefield Engineering
	904-27-2-23-2-B-0	Wakefield Engineering
	904-250	Bivar
	904-080	Bivar
	904-020	Bivar
	904-085	Bivar