60BGA-5

CHEMTRONICS 60BGA-5 吸锡编织带, BGA

The 60-BGA-5 is a Solder-Wick® No Clean, SD Bobbin Desoldering Braid is no clean is designed to provide fast and safe desoldering without leaving behind harmful flux residues, no clean uses pure, oxygen free copper braid and a patented flux technology to make an efficient and effective desoldering braid. No clean SD is on ESD safe bobbins for protection against damage due to static electricity.