7-1542007-4

Heat Sink Passive BGA Pin Array Clip Cold-Forged Aluminum Black Anodized

Product Highlights

Heat Sink

BGA

Package Size = 29 [1.142] mm [in]

For Use With BGA Semiconductor Packages

Diameter = 34.95 mm

Search Keywords:

Thermal Solutions, CoolSnap, Cool Link,

得捷:
29MM HS ASSY ULTEM CLIP

艾睿:
Heat Sink Passive BGA Pin Array Clip Cold-Forged Aluminum Black Anodized

安富利:
Heat Sink Passive BGA Pin Array Clip Cold-Forged Aluminum Black Anodized

Chip1Stop:
Heat Sink Passive BGA Pin Array Clip Cold-Forged Aluminum Black Anodized

Verical:
Heat Sink Passive BGA Pin Array Clip Cold-Forged Aluminum Black Anodized

Powell:
Heat Sink Assemblies

Online Components:
Heat Sink Passive BGA Pin Array Clip Cold-Forged Aluminum Black Anodized

Electro Sonic:
Heat Sink Passive BGA Pin Array Clip Cold-Forged Aluminum Black Anodized

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