W10TR600A-1.0-T1

AMEC THERMASOL  W10TR600A-1.0-T1  热绝缘, 填充垫, +T1, 6 W/m.K, 1 mm, 0.398 °C/W

The is a 1mm thermally conductive Silicone Filler Pad with extremely high thermal conductivity 6W/mK and medium softness 80 shores 00 with high tensile strength. It provides durability in harsh environments whilst conducting heat away from electronic components. As each new generation of electronics equipment exhibits higher performance and more and more power into ever smaller package sizes, it will dissipate power in the form of heat and requires some degree of thermal management. Thermasol markets a variety of thermal management materials in response to the changing needs of the assembly of electronics packaging in notebook computers, high-performance CPU, chipsets, mobile electronic appliances, power conversion and amplification modules etc.

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2.46g/cm³ Specific gravity

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<1% Weight loss

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64psi Tensile strength

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99% Elongation

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>10kV/mm Insulation strength

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UL94V-0 Flammability rating

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-40 to 200°C Operating temperature range

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Adhesive tape fibre-glass side