1N5808

超快速整流器 ULTRA FAST RECTIFIERS

FEATURES:

·  Chip Outline Dimensions: 68 x 68 mils

·  Chip Thickness: 8 to 12 mils

·  Anode Metallization: Aluminum

·  Metallization Thickness: 70,000ÃNominal

·  Bonding Area: 42 x 42 mils Min.

·  Back Metallization: Gold-3000ÃNominal

·  Junction Passivated with Thermal Silicon Dioxide - Planar Design

·  Backside Available with Solderable Ag Backside as JANHCF or JANKCF

艾睿:
Diode Switching 75V 6A 2-Pin Case B-WT