RE510-S1

RE510-S1 / S2 / S3 实验室卡CEM3，1.5 mm 实验室卡 热镀锡（HAL 无铅） **Type** | **RE510-S1** | **RE510-S2** ---|---|--- Size: | 100 x 160 mm | 100 x 220 mm Copper lamination: | 35 μm / one-side | 35 μm / one-side Conductor tracks: | 38 | 38 Drill holes per track: | 61 | 84 Hole pattern: | 2.54x2.54mm | 2.54x2.54mm Hole diameter: | 1 mm | 1 mm 技术参数 --- **类型** | **RE510-S1** | **RE510-S2** | **RE510-S3** 尺寸： | 100 x 160 mm | 100 x 220 mm | 100 x 580 mm 铜叠层： | 35 μm /一面 | 35 μm /一面 | 35 μm /一面 导体轨道： | 38 | 38 | 38 钻孔/轨道： | 61 | 84 | 226 孔模式： | 2.54x2.54mm | 2.54x2.54mm | 2.54x2.54mm 孔直径： | 1 mm | 1 mm | 1 mm ### 条紋板 - 矩阵板

The is a 100 x 160mm dual inline Prototyping Board, made of 1.5mm fibreglass CEM3 and 35µm Cu single-sided construction. This hot air levelling prototyping board comes with 61 holes and 38 continuous strips.

.

1mm Hole diameter

.

2.54 x 2.54mm Hole spacing

.

Lead-free hot air levelling