13258

WS482 3% WATER SOLUABLE CORE SOLDER, SN100C, .050

**The Best Choice for Lead-Free Wave Soldering** SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages is that SN100C offers high-throughput and the lowest cost of ownership as compared to any other lead-free solder alloy. **_Features_**:

* Does Not Contain Silver or Bismuth

* Eutectic Alloy

* Bridge-Free and Icicle-Free Soldering

* Smooth, Bright, Well-Formed Fillets, Free of Gross Micro-Cracks, Irrespective of the Cooling Rate

* Good Through-Hole Penetration

* Good Topside Fillet Formation

* Dross Rate Equal or Lower Than Tin-Lead Solder

* Does Not Require a Nitrogen Atmosphere

* Does Not Erode Copper from Holes, Pads and Tracks

* Low Rate of Copper Leaching Makes It Easy to Control the Copper Content of the Solder Bath

* Lower Aggressiveness to Stainless Steel and Other Solder Pot Materials as Compared to Tin-Silver-Copper Alloys

* Thermal Fatigue Resistance and Creep Strength Better Than Tin-Lead

* Slow, Even Growth of the Intermetallic Layer at the Solder/Substrate Interface

* Also, Performs Well in Selective and Dip Soldering