374124B00035G

AAVID THERMALLOY  374124B00035G  散热器, 方形, 电路板, 用于球栅阵列, BGA, 23.4 °C/W, 18 mm, 23 mm, 23 mm

The is a clear/silver pin-fin Heat Sink with tape attachment suitable for FPGA/BGA packages. It is made of aluminium with black anodize finish.

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Tape mounting saves board space by eliminating mounting holes

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Convenient peel and stick assembly is quick and clean

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Pin-fin array allows omnidirectional airflow to maximize heat dissipation

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Comes with T411 Chomerics tape for all surfaces

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Silicone adhesive