SF005PCN-HM

EMI Connector Gaskets & Grounding Pads Hot Melt Adhesive 500kHz-1GHz

Shielding effectiveness is determined by a combination of two events: reflection and absorption of RF signals. Absorption depends on the bulk, or thickness, of the shield material. However, reflection occurs at the shield surface and its effectiveness is independent of thickness. Reflection is the determining factor for all high frequency signal attenuation.

** Applications:

**

* Bonding or Laminating to Complex Geometric Shapes Includes Optional Hot Melt Adhesive, or Conductive Adhesive Backing

* Large Surface Coverage with Minimal Seams due to 41.0" Material Width 1040 mm

* ESD, RFI-EMI; Shielding Attenuation >70.0 dB up to 10.0 GHz for CuNi Type

* Enclosure Panels and Frames, Seams, Joints, Shield Curtains for Back Panel Openings

* RFI-EMI Conductive Shielding Gasket Cover Membranes

* Architectural Shielding; Shielded Room Finishing — Ceilings, Walls, Floors; Special Purpose Rooms