ICK BGA 23X23X10

FISCHER ELEKTRONIK  ICK BGA 23X23X10  散热器, BGA, 21 °C/W, 10 mm, 23 mm, 23 mm

The is a Heat Sink with black anodised finish suitable for use with universal processors IC design BGA. It offers thermal conductive foil and thermal conductive adhesive way of fixation.

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Universal socket

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2.9W Dissipation loss Pv

艾睿:
Heat Sink Passive BGA Pin Array Adhesive 21K/W

Newark:
# FISCHER ELEKTRONIK  ICK BGA 23X23X10  Heat Sink, BGA, 21 C/W, 10 mm, 23 mm, 23 mm