D55342K07B40B1RWS

Res Thick Film 1206 40.1KΩ 0.1% 0.25W1/4W ±100ppm/℃ 0.01% Molded SMD SMD Waffle Pack

• Fully conforms to the requirements ofMIL-PRF-55342 • Established reliability - verified failure rate; M, P, R, U, S,V, and T levels • Construction is sulfur impervious against a high sulfurenvironment ASTM B 809-95 test method• 100 % group A screening per MIL-PRF-55342 • Termination style B - tin/lead wraparound over nickelbarrier • Operating temperature range is -55 °C to +150 °C

安富利:
Res Thick Film 1206 40.1K Ohm 0.1% 1/4W ±100ppm/°C 0.01% Molded SMD SMD Waffle Pack