APH-127-10-25-S
EUROPEAN THERMODYNAMICS APH-127-10-25-S 冷却模块, 热点/Peltier, 密封, 单级
The is a Thermoelectric Peltier Cooler Module built with high temperature solder with the ability to withstand <200°C assembly processing. Single-stage modules can create systems which are effective from a few mW to few hundred Watts of cooling power. This type of module can be bonded using heat sink bonder temperatures for short periods of time.
- .
- Sealed and lapped for multi-module applications
- .
- Solid-state reliability
- .
- High strength for rugged environments
- .
- High integrity nickel diffusion barriers on elements
- .
- Max delta T performance up to 76°C
- .
- Porched style for enhanced lead wire strength
- .
- Bespoke designs available