860-60G

HEAT TRANS COMPOUND SILICONE

Heat Transfer Compound, 400 V/MIL Dielectric Strength, 2.3 Specific Gravity

Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballasts and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane. The Non-Silicone Heat Transfer compound is designed to eliminate the potential problems of silicone-based compounds caused by migration and component contamination.

* MIL-DTL-47113D

860-60G详细参数

860-60G PDF数据文档

图片	型号	厂商	下载
	860-60G	MG Chemicals
	860-9MMX55M	3M
	860-10/024	Qualtek
	860-04/002	Qualtek
	860-02/001	Qualtek
	860-06/005	Qualtek
	860-04/014	Qualtek
	860-06/016	Qualtek
	860-06/018	Qualtek
	860-04/004	Qualtek
	860-03/008	Qualtek