0440671201

3.00毫米（ 0.118 “ ）间距微飞度3.0 ™线对板头，双排，垂直长达3.56毫米（ 0.140 ” ）厚的PCB ， 12电路，锡（Sn ）镀层 3.00mm .118" Pitch Micro-Fit 3.0™ Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm .140" Thick PCB, 12 Circuits, Tin Sn Plating

Connector Header Through Hole 12 position 0.118" 3.00mm

得捷:
CONN HEADER VERT 12POS 3MM

艾睿:
Conn Power HDR 12 POS 3mm Solder ST Thru-Hole 12 Terminal 1 Port Micro-Fit 3.0™ Frame