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SSC 8250

EDSYN  SSC 8250  焊锡丝, 无铅, 0.8mm直径, 230°C, 250g

The is a Solder Wire with low residues SSC flux according to F-SW32. The flux is made of rosin and of various active agents halide-free and carefully selected for their non corrosive power. The result is in a regular and clean soldered surface, where cleaning of printed circuit boards is not necessary, giving reduction of cost production. Soldering lead-free binary alloy used in the electronic industry.

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Very good mechanical strength
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Bright alloy
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Very good electrical conductibility
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Lead free
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Eutectic alloy containing 0.7% copper with a 227°C melting point

SSC 8250 PDF数据文档
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